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Home Core technologies (Electronics)

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Electronic technologies

SMT PHASE
• Full traceability and automatic MSL control
• 3D solder paste inspection
• Pin in paste assembly PTH automatic insertion and soldering module
• In-line ICT testing and AOI (2D/3D)
• X-ray inspection
ASSEMBLY AND TEST PHASE
• Reconfigurable router (PCB separation)
• Reconfigurable Mechanical Assembly cells
(standard module for automating lasering, testing, assembling and packaging)
• Real time monitoring of production data
• Internal development of testing solution